Download heatpipe assemblies thermal management

HEATPIPE ASSEMBLIES
THERMAL MANAGEMENT
MAKING YOUR HEATPIPE ASSEMBLY MOST
EFFICIENT AND THERMALLY BEST
APPLICATION
HEATPIPE ASSEMBLIES
Thermal Management
Phase Change
Films
PrintableDispensable
TPC-Z-PC
TPC-Z-PC-P
TPC-Z-PC-D
TPC-T-AL-CB
TPC-X-PC-NC
TPC-S-AL
Graphite foil
TFO-S-CB
Silicone foil
TEL-Z-SI
Please contact us as your development partner.
ΔT DATA
10
Phase Change
Graphite Foil
Silicone foil
4
2
Phase Change Film
Phase Change Film
6
Phase Change
∆T (°C)@ 25W / cm2
8
B
C
SC
TF
O-
N
CXP
C-
SI
L
Z-
TE
SA
TP
C-
-C
AL
TC-
L-
TP
TP
TP
CZ
-P
C(
-D
/P
)
B
0
Creating
Maximum thermal contact
Minimized thermal resistance
Compensating mechanic tolerances
Enhancing efficiency
Benefits
Increasing long-term reliability
Homogenizing temperatures
Pre-applied dry-to-the-touch
Chip 220µm
Solder 80µm
Bond Wire
Copper 150µm
AIO Substrate 380µm
Copper 150µm
Solder 80µm
Base Plate 3 mm
Thermal Interface Material 50µm
Heat Sink
Typical module configuration with baseplate (Copper)
Chip 220µm
Solder 80µm
All technical data and information are without warranty and believed to be reliable and accurate. Since
are unknown we cannot guarantee results, freedom from patent infringement, or their suitability for any
HALA Thermal Interface Solutions
the products are not provided to conform with mutually agreed specifications and their use and processing / Release 9 / 2014
application. Product testing by the applicant is recommended. We reserve the right of changes.
making your heatpipe assembly most efficient and thermally best
Bond Wire
Copper 150µm
AIO Substrate 380µm
Copper 150µm
Thermal Interface Material 50µm
Heat Sink
HALA Contec GmbH & Co. KG / Blumenstraße 12 / D-73777 Deizisau / Fon +49 7153 99350-0 / Fax +49 7153 99350-99 /[email protected] / www.hala-tec.de
Typical module configuration without baseplate