Download LHCb ST Infrastructure

Actividades de I+D
en IGFAE/USC
Pablo Vázquez (IGFAE-USC)
IV JORNADAS SOBRE LA PARTICIPACIÓN ESPAÑOLA EN FUTUROS ACELERADORES LINEALES
Madrid, 2-3 Diciembre 2009
R&D activities at Santiago
 R&D in pixel detectors
 R&D in microstrip silicon detectors
 DEPFET project
Belle II PXD PS system
 Sensor characterization (Lab, testbeams)
 Gamma irradiation (Co-60)

 FTD simulations
 Dedicated personnel : 5 FTE

Pablo Vázquez, Abraham Gallas, Daniel Esperante,
Jevgenij Visniakov, Carmen Iglesias, Eliseo Pérez, Javier
Caride
IV jornadas FLC, Madrid, 2-3 Dec 2009
P. Vázquez
1
R&D in pixel detectors
 CERN + LHCb + Timepix/Medipix collaboration






2 test beams summer 2009 at CERN
Telescope (6) + DUT made with Timepix
55 um pixel size
300 um thickness
Hit resolution ~5 um
Track resolution ~2.6 um
IV jornadas FLC, Madrid, 2-3 Dec 2009
P. Vázquez
2
R&D in pixel detectors
 Timepix/Medipix collaboration is working in adapting
the Timepix ASIC for HEP experiments
 Since we have obtained very good results in testbeams
The LHCb VELO upgrade group has decided to choose
the timepix as baseline pixel solution
b) LHCb + Timepix/Medipix has decided to build an
upgraded version of the Timepix telescope (funding
partially requested to AIDA WP9)
a)
IV jornadas FLC, Madrid, 2-3 Dec 2009
P. Vázquez
3
R&D in pixel detectors
a) USC in collaboration with the CNM, Glasgow and CERN are
building thinned pixel detectors
2D sensors thinned up to 200, 150 and 100 um
 To be readout with the Timepix and characterized as
function of the thickness

Charge sharing
Efficiency
Time of arrival measurements
Sensors are being produced now
 Bump-bonding tryout also at CNM
 Possible design variations under discussion

Elongated pixels at 1st row, edgless, gard rings
IV jornadas FLC, Madrid, 2-3 Dec 2009
P. Vázquez
4
R&D in pixel and microstrips silicon sensors
b) Telescope based on Timepix with following
characteristics
Active area: 2.8x2.8 cm2
 Resolucion: 2 um, 1 ns
 Readout rate: 75 kHz


To be used in R&D in detectors for ILC or LHC upgrades
with the contribution of the USC
Timing Unit, integration of the DUT daq in the DAQ of the
telescope
Mechanics of the DUT
Cold box to work with irradiated sensors in the test beam
IV jornadas FLC, Madrid, 2-3 Dec 2009
P. Vázquez
5
R&D in microstrip silicon detectors
 In case the pixel option cannot meet the physics and time
scale requirements, the silicon strip option should hold for
LHCb VELO upgrade
 The strip option should stay as close as possible to the
current design improving its performance
40 MHz readout
 Higher granularity (x10 luminosity increase)
 Impact Parameter resolution
 Radiation hardness

 USC wants to participate in the design and characterization
of the new sensors, in the module assembly and tests with
particle beams at CERN
 Very useful for the FTD conception of ILC
IV jornadas FLC, Madrid, 2-3 Dec 2009
P. Vázquez
6
R&D in microstrip silicon detectors
 1 module assembled in Santiago to be tested in the lab and
in testbeam

IT hybrid (3 beetles) + 2 pitch adapters + PR01 Hamamatsu
sensor
IV jornadas FLC, Madrid, 2-3 Dec 2009
P. Vázquez
7
DEPFET: Belle II PXD PS system
22 x half-module
50cm
IV jornadas FLC, Madrid, 2-3 Dec 2009
 44 half-modules
 17 voltages per
half-module
 Regulation cards
on radiation and
B-field
enviroment
2m
P. Vázquez
8
DEPFET: Belle II PXD PS system
Belle layout
750 voltages
~krad + H field
1500 lines
Regul.
DHH
DHH
Regul.
PXD
PS
> 500W
IV jornadas FLC, Madrid, 2-3 Dec 2009
P. Vázquez
PS
Electronics hut
No radiation
9
DEPFET: sensor characterization
 Lab test
Gain (radioactive source), charge collection (laser)
 Dependence with radiation

241Am
source on a
PXD5 matrix
IV jornadas FLC, Madrid, 2-3 Dec 2009
P. Vázquez
10
DEPFET: sensor characterization
 Testbeams
TB09 data taking and analysis
 Future testbeams

Irradiated module
Power supply prototype
IV jornadas FLC, Madrid, 2-3 Dec 2009
P. Vázquez
11
DEPFET: 2009 test beam analysis
Eutelescope framework installed,
some procesors working
IV jornadas FLC, Madrid, 2-3 Dec 2009
P. Vázquez
12
Gamma irradiation
 Failed depfet PXD5 module irradiation this summer

Module dead before irradiation
 PXD5 matrices being tested in Karlsruhe and Santiago
Dec 09 up to 10Mrad
 PXD6 matrices will be irradiated next year
IV jornadas FLC, Madrid, 2-3 Dec 2009
P. Vázquez
13
ASIC development
 In collaboration with Grupo de Vision Artificial at USC a
project was submitted to Xunta de Galicia to be
produced byTezzaron, using TSVs, a 3D pixel readout
chip demonstrator for HEP applications
CMOS 3D 130nm technology
 64x64 pixels of 40x40 um pixel size
 4 layers

Sensor: pn diode
Signal conditioning: amplification, test pulse, comparator
Signal processing: time stamping, counter, time over
threshold, 8bit memory
Readout
 Possible incorporation of 2 members of this group to the
R&D for FLC project in 2013
IV jornadas FLC, Madrid, 2-3 Dec 2009
P. Vázquez
14
ILC Forward Tracking Disks Simulations
 Hit densities have been determined with the new geometry (ILD_00),
magnetic field (3.5T) and software for each disk
 Baseline 3 inner disks with pixel 4 outer disks with strips
 Density: nhit/cm2/BX (1BX=1event)
FTD_1
Muon1 GeV
2.03* 10-4
Muon10 GeV
2.07 * 10-4
Muon100 GeV
2.03 *10-4
Ttbar
1.09*10-2
FTD_2
1.33*10-4
1.38 * 10-4
1.35 * 10-4
6.34 *10-3
FTD_3
3.84*10-5
3.75 *10-5
3.78 *10-5
2.39 *10-3
FTD_4
2.92*10-5
2.70 * 10-5
2.67*10-5
2.32 *10-3
FTD_5
2.33 *10 -5
1.86 *10-5
1.89 *10-5
1.99 *10-3
FTD_6
2.11 *10-5
1.32 *10-5
1.37 *10-5
1.79 *10-3
FTD_7
1.85 *10-5
9.95 *10-6
1.05 *10-5
1.65 *10-3
IV jornadas FLC, Madrid, 2-3 Dec 2009
P. Vázquez
15
ILC Forward Tracking Disks Simulations
 Disk segmentation in petals has
also been optimized with the
constrain of the wafer size
 Hit density more uniform than
a simple 8 petal/disk
segmentation
nhits/cm2/BX
Area
cm2
Muons
1 GeV
Muons
10 GeV
Muons
100GeV
Ttbar->
bbcssc
FTD_1 (8 pet)
99.6
1.90 *10-4
2.14 * 10-4
2.11 * 10-4
1.06 *10-2
FTD_2 ( 8 pet)
99.13
1.12 *10-4
1.35 *10 -4
1.36*10 -4
6.01 *10-3
FTD_3 (20 pet)
165.93
3.01 * 10-5
2.94*10-5
3.56 *10-5
2.56 *10 -3
FTD_4 (16 pet)
167.72
2.35* 10-5
2.61 *10-5
2.67 *10-5
2.07 * 10-3
FTD_5 (16 pet)
154.13
2.23 * 10-5
1.65*10-5
1.65*10-5
1.98 * 10-3
FTD_6 (16 pet)
136.93
2.67* 10-5
1.69 *10-5
1.37 *10-5
1.81 *10-3
FTD_7 (16 pet)
116.19
2.02*10-5
1.42 *10-5
8.39 *10-6
1.67 * 10-3
IV jornadas FLC, Madrid, 2-3 Dec 2009
P. Vázquez
 According to the hit density
disk 3 should probably have
the same technology than
the outer disks
16
Summary on R&D activities in the USC
 R&D in pixel detectors
 R&D in microstrips silicon detectors
 DEPFET project
Belle II PXD PS system
 Sensor characterization (Lab, testbeams)
 Gamma irradiation (Co-60)

 FTD simulations
IV jornadas FLC, Madrid, 2-3 Dec 2009
P. Vázquez
17