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A new era of pixel detectors for future
High Energy Physics experiments
Sonia Fernandez-Perez
Workshop física teorica UVA– 27.05.2016
1
Outline
§ 
§ 
§ 
§ 
TheLargeHadronCollider(LHC)
TheATLASdetector
TheHL-LHCprogram
Basicworkingprincipleandchallengesofpixeldetectors
§  PixeldetectorsdevelopmentsforATLASatHL-LHC
Workshop física teórica UVA - Sonia Fernandez-Perez
2
TheLargeHadronCollider
§  TheStandardModeldescribesallelementaryparFclesandtheirinteracFons
§  Itisincomplete(noexplanaFontogravitaFonalinteracFons,darkmaIer,asymmetry
maIer-anFmaIer,etc)
Workshop física teórica UVA - Sonia Fernandez-Perez
3
TheLargeHadronCollider
§  TheStandardModeldescribesallelementaryparFclesandtheirinteracFons
§  Itisincomplete(noexplanaFontogravitaFonalinteracFons,darkmaIer,asymmetry
maIer-anFmaIer,etc)
proton-protoncollider
27kmcircumference
100munderground
During the first data taking period Run 1 (2009-2012)
luminosity of 1034 cm-2s-1, collision energy of 7-8 TeV,
and 50 ns bunch crossing.
§  4mainexperiments:ALICE,ATLAS,CMS,LHCb
§ 
§ 
§ 
§ 
5 km
Workshop física teórica UVA - Sonia Fernandez-Perez
4
TheLargeHadronCollider
§  TheStandardModeldescribesallelementaryparFclesandtheirinteracFons
§  Itisincomplete(noexplanaFontogravitaFonalinteracFons,darkmaIer,asymmetry
maIer-anFmaIer,etc)
§ 
§ 
§ 
§ 
proton-protoncollider
27kmcircumference
100munderground
4mainexperiments:ALICE,ATLAS,CMS,LHCb
CMS
5 km
ALICE
ATLAS
Workshop física teórica UVA - Sonia Fernandez-Perez
LHCb
5
TheLargeHadronCollider
§  TheStandardModeldescribesallelementaryparFclesandtheirinteracFons
§  Itisincomplete(noexplanaFontogravitaFonalinteracFons,darkmaIer,asymmetry
maIer-anFmaIer,etc)
§ 
§ 
§ 
§ 
Higgsdiscovery(2012)
proton-protoncollider
27kmcircumference
100munderground
4mainexperiments:ALICE,ATLAS,CMS,LHCb
CMS
5 km
ALICE
ATLAS
Workshop física teórica UVA - Sonia Fernandez-Perez
LHCb
6
IntroducFonTheATLASdetector
MuonDetector
ElectromagneFc
Calorimeter
InnerDetector
HadronicCalorimeter
Workshop física teórica UVA - Sonia Fernandez-Perez
7
IntroducFonTheATLASdetector
InnerDetector
Workshop física teórica UVA - Sonia Fernandez-Perez
8
IntroducFonThePixelDetector
•  ThePixelDetectorisexposedtothe
harshestcondiFons
•  4silicondetectorlayers
InsertableB-Layer(IBL)installedin2014
Workshop física teórica UVA - Sonia Fernandez-Perez
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IntroducFonThePixelDetector
•  ThePixelDetectorisexposedtothe
harshestcondiFons
•  4silicondetectorlayers Atrue4-hitpixelsystem!
InsertableB-Layer(IBL)installedin2014
Workshop física teórica UVA - Sonia Fernandez-Perez
10
IntroducFonThePixelDetector
•  ThePixelDetectorisexposedtothe
harshestcondiFons
•  4silicondetectorlayers
•  Eachlayeriscomposedof
2Dsegmentedsilicondetectors
Workshop física teórica UVA - Sonia Fernandez-Perez
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IntroducFonParFcle’strackingdetectors
•  Layersofsegmentedsilicondetectors
•  TheenergylossbytheparFclewhiletraversingthedetectoràelectricalsignal
proton
proton
Workshop física teórica UVA - Sonia Fernandez-Perez
12
IntroducFonParFcle’strackingdetectors
•  Layersofsegmentedsilicondetectors
•  TheenergylossbytheparFclewhiletraversingthedetectoràelectricalsignal
Position sensitive layers
proton
proton
Workshop física teórica UVA - Sonia Fernandez-Perez
13
IntroducFonParFcle’strackingdetectors
•  Layersofsegmentedsilicondetectors
•  TheenergylossbytheparFclewhiletraversingthedetectoràelectricalsignal
Position sensitive layers
proton
proton
Workshop física teórica UVA - Sonia Fernandez-Perez
14
IntroducFonParFcle’strackingdetectors
•  Layersofsegmentedsilicondetectors
•  TheenergylossbytheparFclewhiletraversingthedetectoràelectricalsignal
Position sensitive layers
proton
proton
Workshop física teórica UVA - Sonia Fernandez-Perez
15
IntroducFonSignalgeneraFononsilicondetectors
•  pixel sensor: a 2D segmented pn-diode (reversely bias à depletion zone)
pn-junc;on
Workshop física teórica UVA - Sonia Fernandez-Perez
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IntroducFonSignalgeneraFononsilicondetectors
•  pixel sensor: a 2D segmented pn-diode (reversely bias à depletion zone)
pn-junc;on
Reverselybiaspn-junc;on
Workshop física teórica UVA - Sonia Fernandez-Perez
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2
2
10
MHz/mm
1
MHz/mm
IntroducFonSignalgeneraFononsilicondetectors
1 Grad
50 Mrad
2 ⇥ 1016 neq cm 2 1 ⇥ 1015 neq cm 2
•  pixel sensor:
bias à depletion zone)
2 a 2D segmented pn-diode (reversely
2
⇡1 m zone is the zone⇡10
20charge
m carriers
•  Depletion
without-free
200
0V
0V
0V
the ATLAS
Pixel Detector
for the+ LHC and for the HL-LHC.
+
+
n
n
n
ed in this
table are extracted from.
W
W =
p+
s
d
2✏✏0
(V0
q|Nef f |
Vb )
p bulk
(0.1)
Vb
p
W = 2 ✏ µ ⇢ Vb
1
µ q |Nef f |
(0.2)
Nef f = Nd
Na
(0.3)
Workshop física teórica UVA - Sonia Fernandez-Perez
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2
2
10
MHz/mm
1
MHz/mm
IntroducFonSignalgeneraFononsilicondetectors
1 Grad
50 Mrad
2 ⇥ 1016 neq cm 2 1 ⇥ 1015 neq cm 2
•  pixel sensor:
bias à depletion zone)
2 a 2D segmented pn-diode (reversely
2
⇡1 m zone is the zone⇡10
20charge
m carriers
•  Depletion
without-free
200
0V
0V
0V
0V
the ATLAS
Pixel Detector
for the+ LHC and for the HL-LHC.+
+
+
n
n
n
n
ed in this
table are extracted from.
- +
- +
- +
- +
W
W =
p+
s
d
2✏✏0
(V0
q|Nef f |
Vb )
p bulk
(0.1)
p+
0V
n+
depleted
p bulk
Vb
Vb
p
W = 2 ✏ µ ⇢ Vb
1
µ q |Nef f |
increasing
bias voltage
0V
n+
Nef f = Nd
•  AparFcletraversingthesensor
(0.2)
generateselectron-holepairs
•  SignalgeneraFonàdriTanddiffusion
•  ATLASrequirements:driT
•  ThesignalisamplifiedanddigiFzed
inaR/Ochip
(0.3)
Na
Workshop física teórica UVA - Sonia Fernandez-Perez
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LHCpixeldetectors
•  Verygoodperformanceandreliabilitysince2009
•  NotsufficientforlongtermLHCplansofluminosityincrease
Workshop física teórica UVA - Sonia Fernandez-Perez
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IntroducFonHighLuminosityLHC
•  Whydoweneedhighluminosity?
frequencytoobtainanspecificevent:
Nevent = Luminosity x σevent
σ (pp) = 1011 pb
σ (W/Z) = 104 pb
σ (H) = 100 pb
Workshop física teórica UVA - Sonia Fernandez-Perez
21
IntroducFonHighLuminosityLHC
•  Whydoweneedhighluminosity?
frequencytoobtainanspecificevent:
Nevent = Luminosity x σevent
σ (pp) = 1011 pb
σ (W/Z) = 104 pb
σ (H) = 100 pb
•  TheLHCplanstoincreasebyafactorof7theluminosityin2026àHL-LHCprogram
[luminosityof7*1034cm-2s-1,collisionenergyof14TeV,
and25nsbunchcrossing]
DetectorimplicaFons:
•  RadiaFonharddetectors
•  Highrate
•  Fastdetectors
Workshop física teórica UVA - Sonia Fernandez-Perez
22
IntroducFonTheATLASInnerTracKer(ITk)
•  ThefullInnerDetectorofATLASwillbereplacedbyanewall-silicondetector
•  PixelsandStrips
•  ThePixelDetectorlayoutisunderdiscussion(4-6layers)
•  Therequirementsareatleastoneorderofmagnitudehigher
Workshop física teórica UVA - Sonia Fernandez-Perez
23
IntroducFonTheATLASInnerTracKer(ITk)
•  ThefullInnerDetectorofATLASwillbereplacedbyanewall-silicondetector
•  PixelsandStrips
•  ThePixelDetectorlayoutisunderdiscussion(4-6layers)
•  Therequirementsareatleastoneorderofmagnitudehigher
Workshop física teórica UVA - Sonia Fernandez-Perez
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IntroducFonTheATLASInnerTracKer(ITk)
•  ThefullInnerDetectorofATLASwillbereplacedbyanewall-silicondetector
•  PixelsandStrips
•  ThePixelDetectorlayoutisunderdiscussion(4-6layers)
•  Therequirementsareatleastoneorderofmagnitudehigher
Hybridtechnology
Hybridtechnology
PlanarPixelSensor(PPS) PlanarPixelSensor(PPS)
3DSiliconsensor(3D)
Workshop física teórica UVA - Sonia Fernandez-Perez
25
IntroducFonTheATLASInnerTracKer(ITk)
•  ThefullInnerDetectorofATLASwillbereplacedbyanewall-silicondetector
•  PixelsandStrips
•  ThePixelDetectorlayoutisunderdiscussion(4-6layers)
•  Therequirementsareatleastoneorderofmagnitudehigher
Hybridtechnology
Hybridtechnology
PlanarPixelSensor(PPS) PlanarPixelSensor(PPS)
3DSiliconsensor(3D)
Innerlayers
1.  Radia;onhardness
2.  Lowpowerconsump;on
3.  Lowmaterial
4.  Occupancy
26
IntroducFonTheATLASInnerTracKer(ITk)
•  ThefullInnerDetectorofATLASwillbereplacedbyanewall-silicondetector
•  PixelsandStrips
•  ThePixelDetectorlayoutisunderdiscussion(4-6layers)
•  Therequirementsareatleastoneorderofmagnitudehigher
Hybridtechnology
Hybridtechnology
PlanarPixelSensor(PPS) PlanarPixelSensor(PPS)
3DSiliconsensor(3D)
Outerlayers
Innerlayers
1.  ;meschedule
1.  Radia;onhardness
2.  Lowpowerconsump;on 2.  Lowcost
3.  LowpowerconsumpFon
3.  Lowmaterial
4.  Lowmaterial
4.  Occupancy
Workshop física teórica UVA - Sonia Fernandez-Perez
27
IntroducFonTheATLASInnerTracKer(ITk)
•  ThefullInnerDetectorofATLASwillbereplacedbyanewall-silicondetector
•  PixelsandStrips
•  ThePixelDetectorlayoutisunderdiscussion(4-6layers)
•  Therequirementsareatleastoneorderofmagnitudehigher
Hybridtechnology
Hybridtechnology
PlanarPixelSensor(PPS) PlanarPixelSensor(PPS)
3DSiliconsensor(3D)
Outerlayers
Innerlayers
1.  ;meschedule
1.  Radia;onhardness
2.  Lowpowerconsump;on 2.  Lowcost
3.  LowpowerconsumpFon
3.  Lowmaterial
4.  Lowmaterial
4.  Occupancy
Workshop física teórica UVA - Sonia Fernandez-Perez
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PixeldevelopmentsforATLASatHL-LHC.FromHybrid
detectorstodepletedMonolithicdetectors
Workshop física teórica UVA - Sonia Fernandez-Perez
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Hybriddetectortechnologies
Hybrid pixels
•  Sensor+front-endchipseparatedenFFes
•  SignalcollectedbydriT
•  Maturetechnology(inusesinceLEP1996)
Workshop física teórica UVA - Sonia Fernandez-Perez
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Hybriddetectortechnologies
Hybrid pixels
•  Sensor+front-endchipseparatedenFFes
•  SignalcollectedbydriT
•  Maturetechnology(inusesinceLEP1996)
Advantages
• 
Complexsignalprocessingalready
inpixelcellpossible
• 
• 
• 
zerosuppression,temporarystorage
ofhitsduringL1latency
RadiaFonhardto>1015neq/cm2
Highratecapability(~MHz/mm2)
Workshop física teórica UVA - Sonia Fernandez-Perez
31
Hybriddetectortechnologies
Hybrid pixels
•  Sensor+front-endchipseparatedenFFes
•  SignalcollectedbydriT
•  Maturetechnology(inusesinceLEP1996)
Advantages
• 
Complexsignalprocessingalready
inpixelcellpossible
• 
• 
• 
zerosuppression,temporarystorage
ofhitsduringL1latency
RadiaFonhardto>1015neq/cm2
Highratecapability(~MHz/mm2)
Disadvantages
• 
ComplexandlaboriousmoduleproducFon
• 
• 
• 
• 
ManyproducFonstepsàlowproducFonyield
Bump-bonding/flip-chippingàlimiFngpixelsize
Expensive
RelaFvelylargematerialbudget~3%Xoperlayer
• 
• 
sensor+chip+flexkapton+passivecomponents
support,cooling,services
Workshop física teórica UVA - Sonia Fernandez-Perez
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Hybridsensorstechnologies
PlanarPixelSensor(PPS)
§  TechnologyusedinpresentPixelDetector
§  CollecFondistance=driTdistance
§  HighproducFonyield(%)
•  Largeareasensors
n+-readout
n-bulk
-
-+
-+ +
-+
+-+
+
-+
guard rings
p+-bias
Workshop física teórica UVA - Sonia Fernandez-Perez
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Hybridsensorstechnologies
PlanarPixelSensor(PPS)
3DSiliconSensor(3D)
§  TechnologyusedinpresentPixelDetector
§  CollecFondistance=driTdistance
§  HighproducFonyield(%)
•  Largeareasensors
§  TechnologyinstalledforthefirstFmeIBL
§  CollecFon-anddriTdistancedisconnected
§  MoredifficultproducFon,loweryield
•  Smallerareasensors
n+-readout
n-bulk
-
-+
-+ +
-+
+-+
-+ -+
+
-+
p-bulk
+
-+
+
-
-+
guard rings
p+-bias
guard rings
rings
guard
Workshop física teórica UVA - Sonia Fernandez-Perez
+
+-biaspillars
pp+-bias
34
10 MHz/mm
1 MHz/mm
CMOSPixelTechnologies
1 Grad
50 Mrad
2 ⇥ 1016 neq cm 2 1 ⇥ 1015 neq cm
⇡1 m2 pixels
⇡10 - 20 m2
CMOS-based
•  Industrialprocess
200
-
2
•  higherproducFonyield
•  cheapersensors
he ATLAS
Pixel Detector for the LHC and for the HL-LHC.
•  this
CollecFngelectrodeinsideàlogicimplementaFoninsamesiliconFle
d in
table are extracted from.
àcapaciFvecoupledconnecFons,monolithic…
•  smallercost
•  ssmallermaterialbudget
2✏✏0
•  smallerpixelsize
W =
(V0 Vb )
q|Nef f |
•  Therearetwoapproaches
p
W = 2 ✏ µ ⇢ Vb
à  HV-CMOS
à  HR-CMOS
(0.1)
(0.2)
•  Bothtechnologiesaredevelopedsofarashybridapproach
1
Nef f = Nd Na
(0.3)
µ q |Nef f |
Workshop física teórica UVA - Sonia Fernandez-Perez
35
10 MHz/mm
1 MHz/mm
CMOSPixelTechnologies
1 Grad
50 Mrad
2 ⇥ 1016 neq cm 2 1 ⇥ 1015 neq cm
⇡1 m2 pixels
⇡10 - 20 m2
CMOS-based
•  Industrialprocess
200
-
2
•  higherproducFonyield
•  cheapersensors
he ATLAS
Pixel Detector for the LHC and for the HL-LHC.
•  this
CollecFngelectrodeinsideàlogicimplementaFoninsamesiliconFle
d in
table are extracted from.
àcapaciFvecoupledconnecFons,monolithic…
•  smallercost
•  ssmallermaterialbudget
2✏✏0
•  smallerpixelsize
W =
(V0 Vb )
q|Nef f |
•  Therearetwoapproaches
p
W = 2 ✏ µ ⇢ Vb
à  HV-CMOS
à  HR-CMOS
(0.1)
(0.2)
•  Bothtechnologiesaredevelopedsofarashybridapproach
1
Nef f = Nd Na
(0.3)
µ q |Nef f |
Workshop física teórica UVA - Sonia Fernandez-Perez
36
Monolithic Active Pixel Sensors
MAPS epitaxial layer
• 
• 
• 
• 
• 
ALICE ITS (L. Mussa)
ComplexR/Oelectronicsinsensorlayer
needed.
HighresisFvityepitaxiallayer
SlowchargecollecFon(diffusion)
“low”radiaFonhardness
STAR(2014),ALICEITS(2018)
Workshop física teórica UVA - Sonia Fernandez-Perez
37
Monolithic Active Pixel Sensors
MAPS epitaxial layer
• 
• 
• 
• 
• 
ALICE ITS (L. Mussa)
STAR/RHIC
ComplexR/Oelectronicsinsensorlayer
needed.
HighresisFvityepitaxiallayer
SlowchargecollecFon(diffusion)
“low”radiaFonhardness
STAR(2014),ALICEITS(2018)
ALICEUpgrade
38
Monolithic Active Pixel Sensors
MAPS epitaxial layer
ComplexR/Oelectronicsinsensorlayer
needed.
HighresisFvityepitaxiallayer
SlowchargecollecFon(diffusion)
“low”radiaFonhardness
STAR(2014),ALICEITS(2018)
• 
• 
• 
• 
• 
ALICE ITS (L. Mussa)
Depleted MAPS
• 
• 
• 
• 
ComplexR/Oelectronicsinsensorlayer
needed.
Highvoltage/highresisFvityprocess
FastchargecollecFon(driT)
[BELLEIIDEPFET]
Workshop física teórica UVA - Sonia Fernandez-Perez
39
Monolithic Active Pixel Sensors
MAPS epitaxial layer
• 
• 
• 
• 
• 
ALICE ITS (L. Mussa)
Depleted MAPS
ComplexR/Oelectronicsinsensorlayer
needed.
HighresisFvityepitaxiallayer
SlowchargecollecFon(diffusion)
“low”radiaFonhardness
STAR(2014),ALICEITS(2018)
BelleII(SuperKEK)
40
Depleted Monolithic Active Pixel Sensors
Depleted MAPS Silicon-On-Insulator
0V
VDD
N
N
P
P
• 
Buried Oxide (BOX)
Collecting electrode
Si-bulk
• 
Silicon-On-Insulatortoseparatelogicfromsensor
diode.Severaladvantages:
•  Decouplingofelectronicsandsensorsilicon
resisFvity
•  NocompeFngNWELL
•  Freechoiceoffillfactor
•  Lowercross-talk
ChargecollecFonbydriT
Workshop física teórica UVA - Sonia Fernandez-Perez
41
Depleted Monolithic Active Pixel Sensors
Depleted MAPS Silicon-On-Insulator
0V
0V
VDD
N
N
P
N
P
N
P
VDD
P
Buried Oxide (BOX)
~µm
Collecting electrode
Buried Oxide
(BOX)
CollecFngelectrode
Si-bulk
Si bulk
Thick film
Standard
• 
• 
• 
• 
Distancetransistors-BOX~nm
Ultra-thintransistorbody~O(40nm)FD
RadiaFonhardnessverychallenging
OKI/LAPIS
•  Distancetransistors-BOX~µm
•  ThicktransistorbodyPD
•  MulFple“wells”structures
Workshop física teórica UVA - Sonia Fernandez-Perez
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Summaryofpixeldevelopmentsfeatures
Hybrid
CMOSpixels
MonolithicCMOS
Examples
3D,Planar
(ATLAS,CMS,
LHCvelo,Timepix3)
HV-CMOS
HR-CMOS
MAPS(STAR,ALICEITS)
DMAPSSOI
Technology
Industrystandard
R/Oandsensors
forreadout;special integrated,closeto
high-Ωsensors
industrialprocess
R/Oandsensorinsame
pieceofsilicon;
Industrialprocess
InterconnecFon Bump-bonding
required
ConnecFvity
facilitated(CCPD)(or
monolithicapproach)
Noneeded
Granularity
50μmx50μm
Downtofew-micron
sizes
Downtofew-micron
sizes
Timing
Fast
Coarsebutimproving
Coarsebutimproving
RadiaFon
hardness
Feasible
Tobeproven
Tobeproven
43
Summaryofpixeldevelopmentsfeatures
Hybrid
CMOSpixels
MonolithicCMOS
Examples
3D,Planar
(ATLAS,CMS,
LHCvelo,Timepix3)
HV-CMOS
HR-CMOS
MAPS(STAR,ALICEITS)
DMAPSSOI
Technology
Industrystandard
R/Oandsensors
forreadout;special integrated,closeto
high-Ωsensors
industrialprocess
R/Oandsensorinsame
pieceofsilicon;
Industrialprocess
InterconnecFon Bump-bonding
required
ConnecFvity
facilitated(CCPD)(or
monolithicapproach)
Noneeded
Granularity
50μmx50μm
Downtofew-micron
sizes
Downtofew-micron
sizes
Timing
Fast
Coarsebutimproving
Coarsebutimproving
RadiaFon
hardness
Feasible
Tobeproven
Tobeproven
44
Summaryofpixeldevelopmentsfeatures
Hybrid
CMOSpixels
MonolithicCMOS
Examples
3D,Planar
(ATLAS,CMS,
LHCvelo,Timepix3)
HV-CMOS
HR-CMOS
MAPS(STAR,ALICEITS)
DMAPSSOI
Technology
Industrystandard
R/Oandsensors
forreadout;special integrated,closeto
high-Ωsensors
industrialprocess
R/Oandsensorinsame
pieceofsilicon;
Industrialprocess
InterconnecFon Bump-bonding
required
ConnecFvity
facilitated(CCPD)(or
monolithicapproach)
Noneeded
Granularity
50μmx50μm
Downtofew-micron
sizes
Downtofew-micron
sizes
Timing
Fast
Coarsebutimproving
Coarsebutimproving
RadiaFon
hardness
Feasible
Tobeproven
Tobeproven
45
hMp://visits.web.cern.ch
Workshop física teórica UVA - Sonia Fernandez-Perez
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hMp://jobs.web.cern.ch
Workshop física teórica UVA - Sonia Fernandez-Perez
47
ThankforyouraIenFon
48
Spareslides
49
LINAC2:50MeV
ProtonSynchrotronBooster(PSB):1.4GeV
ProtonSyncrotron(PS):25GeV
SuperProtonSyncrotron(SPS):450GeV
50
51
ParFclecollidersrequirements
[SlidebyN.Wermes,Elba2015]
52
[SlidebyL.Linssen,FinalTALENTConference]
53
IntroducFonParFcle’strackingdetectors
•  Layersofsegmentedsilicondetectors
•  TheenergylossbytheparFclewhiletraversingthedetectoràelectricalsignal
•  ThelossofenergybychargedparFclesinmaIeràinelasFccollisions
Chargedpar;cles(m>>me)
•  ExcitaFonandionizaFonofatoms
•  Partoftheenergyistransferredtotheatom
•  Bethe-Blochformula
Chargedpar;cles(m~me)
•  IonizaFonofatoms+other
•  AthighenergiesàBremsstrahlungdominates
MIP
(Minimum
IonizaFon
ParFcle)
54
Transversemomentumresolu;on
VertexandImpactParameterresolu;on
55
Requirementstodesignatrackingdetector
56
CMOSPixelTechnologies
HV-CMOS
•  HVtechnology(100V)
•  Logicin-sensor
•  Twoapproaches
•  Bump-bondedtodedicatedR/Ochip
•  CapaciFvecouplingviaisolaFngglue
•  Provenupto
• 
• 
• 
• 
1GRadTID,1015neqcm-2
99%(96%)efficiencybefore(aTer)irr
depleFondepth10-20μmat100V
signalrise-Fme100ns
HR-CMOS
•  HighresisFvitysubstrate(1-2KΩcm)
•  TwovariantsarebeinginvesFgated
•  differentgeometries
•  Twoapproaches
•  Bump-bondedtodedicatedR/Ochip
•  Monolithic
•  Provenupto
•  DepleFon60μmat20V(6200e-)
•  Rise-Fmewithin25ns(thresholddependency)
•  AHV-CMOSprototypein350nmproduced •  AHR-CMOSprototypein150nmselected
inlargescale(2x2cm)
àproducFoninlargescale(2x2cm)
57
XTB01 prototype
HVring
25x25μm2
AU25/50grid
(matrix25/50)
n-wellring
50x50μm2
AU50V2grid
(matrix50)
100x100μm2
AU100grid
(matrix100)
0V
P
NWELL
PWELL
double PWELL
BOX
N
N
P
P
NWELL
PWELL
double PWELL
BOX
deep NWELL
e
ee-
HV grid
DTI
N
P
DTI
VDD
N
HV grid
DTI
(Pixel cross section. No to scale)
teststructures
P bulk
•  2x5mm2
•  300μmthick
•  4metallayers,wafersize:8“
•  Fourmatriceswithdifferentpixelsizes
(25x25μm2,50x50μm2,100x100μm2)
•  Transistorteststructures
•  HVring,gridrings,n-rings
•  thickfilmDMAPSSOI
0.18µm
•  BOXisolatessensorand
electronics
•  thickfilm,doublePWELL
•  noback-processing(HV
appliedfromfrontside)
•  MIPdetecFon
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